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Product Details:
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Item Name: | Phase Change Thermal Interface Material Thermal Pad | PCMs: | Flexible TX-PCMs Polymer Based PCMs |
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Die Cut: | Yes | Thermal Resistance: | Low |
Thickness And Dimension: | Customized | Applications: | Electronic Devices Versatility Usage |
Highlight: | Electronic PCM Heat Sink,Silicone Free PCM Heat Sink,TX PCMs phase change material heat sink |
1, Features
Phase change Material PCMs interface thermal pad for electronic heat sink
Phase change material is polymer based composition PCMs
With Graphite incorporated for high thermal conductivity
They are silicone-free for occasions of silicone sensitive
Solid state only without volume expansion problem
37℃~53℃Phase change melting point temperature available
Shape and dimension can be molded cut
They are quite flexible in usage, can be generic utilized in various electronic device
Significantly improve the performance of electronic equipment and extend the life cycle of the components
The are low cost with maintenance free
They are low thermal resistance
They are non-flammable, safe in use
2, Descriptions
Thermal management is of crucial importance to the electronic industry, smaller and tightly packaged circuits and high speed components create excess heat which ultimately affects the reliability and life cycles of numerous electric devices
With expectations for further miniaturization, the need for develop sustainable and suitable heat remover to mitigate the problems is more essential.
Our high-performance phase change interface material is polymer based PCMs designed to meet the thermal reliability and price requirements of high-end thermal applications. The series is inherently tacky, flexible and extremely easy-to-use, they are silicone free, suitable for occasion where silicone based material using as well as the place silicone sensitive.
Our phase change interface material is solid at room temperature and is convenient to install, used between the heat sink and device.
When they reach the PCMs phase change melting temperature, materials begins to soften and flowing, and filling the micron irregularities of the components contact surface, thus enable for minimizing thermal contact resistance at the interfaces.
Our polymer based phase change interface thermal pad is better than that of non flow elastomeric or graphite based thermal pads.
3, Applications
Our PCMs thermal pad with shape and size can be die-cut, they are use extensively in the electronic heat sink devices as followings:-
High frequency/Speed microprocessors
Notebook and desktop PC
Mobile phones
Hard disk drives
Memory Modules
Cache Chips
LED lighting
Wireless infrastructure
Power semiconductors
Contact Person: Mr. JOHNNY CHEN
Tel: 86-18989333289
Fax: 86-574-87171612